Home Product Memory Desktop XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 32GB(4x8GB) 4000MHz CL18

XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY

FEATURE & CAUTION
FEATURE
  • The finest crafted heat spreader with unique trench design
  • High-efficiency aluminum heat spreader
  • 10 layers of circuit board
  • Selected high quality SAMSUNG original IC chips
  • 1.2V~1.4V ultra low working voltage
  • Support Intel XMP 2.0 smart overclocking technology
  • QVL approved by motherboard manufactures in the market

CAUTION
  • For a complete list of compatible platforms, please refer to the "Compatibility Inquiry" section.
  • Before purchasing memory products, please check the QVL (Qualified Vendor List) compatibility list provided by the motherboard manufacturer.
  • Do not mix memory modules of different capacities, frequencies, brands, or models. Each memory kit is paired through compatibility testing. Mixing different kits may cause system instability or failure to boot.
  • The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
  • The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility.
  • If XMP 2.0 (Intel) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR4-2133/2400 (or lower). This is a normal phenomenon and not a product defect.
  • XMP 2.0 must be manually enabled by the user. Some motherboards may not reach the stated frequency, as the final operating frequency depends on system settings.
  • Overclocking (such as enabling XMP 2.0 settings) is not part of the JEDEC standard and may affect system stability. If overclocking causes system instability, please revert to the BIOS default settings.
  • The stated frequency of the memory module is the maximum achievable frequency. However, not all systems will be able to reach it.
  • Ensure that your motherboard and processor support the corresponding overclocking technologies (XMP 2.0); otherwise, the memory may not reach the advertised overclocking frequency.
  • TEAMGROUP memory modules are tested under normal voltage conditions. If there are any issues related to processor or motherboard malfunctions, please contact the respective after-sales service of the processor or motherboard manufacturer.
Lifetime Warranty
QVL Compatibility Certification
Intel XMP2.0
High-Quality IC
Aluminum Heat Dissipation Solution
T-FORCE fit with OCUK, Powered and Certified by 8 pack

T-FORCE fit with OCUK, Powered and Certified by 8 pack

Now the T-FORCE series XTREEM and DARK PRO are certified by OCUK famous overclocking champion "8 pack" to publish all the powerful specifications, which means these DRAM modules are all passed the serious stress performance test and quality insured to be the special 8 packs and T-FORCE edition. No doubt and guaranteed will be the top notch!! Below is the details and link: 8PACK.
The unprecedented moment of glory

The unprecedented moment of glory

In the date of January 13th, 2017, when Thai Overclocker, “Audigy”, submitted the historic DDR4 5260.8mhz to the CPUZ as DRAM world record frequency, the whole overclocking world was shocked by how amazing T-FORCE XTREEM is. Yet after the storm, the XTREEM never took the rest, Audigy sealed another world record, 5280Mhz, in the date of March 30th, 2017.
Global overclocking new record

Global overclocking new record

Until this moment as May of 2017, the world’s top 3 records are all in the name of TEAMGROUP T-FORCE XTREEM. Consequently, this DRAM overclocking legend is born, “The Special Edition of T-FORCE XTREEM!.” It is made by high selected and hand screened IC from SAMSUNG Original 21st Nano –Micron DDR4 B-die IC topped Jedec newest RC 2.0 pcb, and high quality aluminum CNC craft heat spreader with overclocking mentor, Onepagebook, use high power laser technology autograph on the pure black coating T-FORCE name plate. The quantity of this XTREEM Special Edition is highly restricted for only 50 sets. It is only for the people who would like to ride to the journey of their own world record.
With unique trench design and improve radiating performance 10%

With unique trench design and improve radiating performance 10%

The TEAMGROUP design team had built a heat spreader with an all new exterior design concept. The overclocking memory module with highest specification is built by top notch aluminum extrusion process and CNC machining. The unique trench design can increase the radiating area to improve radiating efficiency. XTREEM combines simple and magnificent design with its top specification overclocking memory module. The clean, sleek lines are able to magnify its high speed specification.
RC2.0 board largely improves stabilit

RC2.0 board largely improves stabilit

The number of PCB layers is 25% more than normal memories. This provides better efficiency and performance since the power layer and the signal layer has a farther distance between each other. Without the interference between the power and the signal, it can offer players the overclocking pleasure and a high stability overclocking memory module.
Selected high quality SAMSUNG original IC chips

Selected high quality SAMSUNG original IC chips

TEAMGROUP insists on using high quality SAMSUNG original IC chips and passed through various rigorous internal tests. Its high reliability makes players feel at ease.
Ultra low working voltage Save energy up to 40%

Ultra low working voltage Save energy up to 40%

With low working voltage 1.2~1.4V from DDR4 XTREEM , it is not only energy saving but it can also reduce the temperature and the heat generated to offer the high speed running memory a stable and long time operation.
XMP2.0 1 step overclocking technology

XMP2.0 1 step overclocking technology

All XTREEM series support Intel XMP 2.0. It is only one step away to experience the high speed sensation of overclocking.
QVL approved by motherboard manufacturers

QVL approved by motherboard manufacturers

Multiple compatibility verifications with mainstream DDR4 motherboards to make sure its stability with all motherboards on the QVL(Qualified Vendor List). Therefore, you wouldn’t’ have to worry about compatibility issues when purchasing high speed memory.
Module Type Capacity Frequency Latency Data Transfer Bandwidth Voltage Compatibility TEAM P/N Compare
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 32GB(4x8GB) 4500MHz CL18 36000 MB/s 1.45V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD416G4500HC18EDC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 32GB(4x8GB) 4000MHz CL18 32000 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD432G4000HC18FQC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 64GB(4x16GB) 3600MHz CL16 28800 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD464G3600HC17AQC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 32GB(4x8GB) 3600MHz CL16 28800 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD432G3600HC16AQC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 64GB(4x16GB) 3200MHz CL16 25600 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD464G3200HC16CQC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 32GB(4x8GB) 3200MHz CL16 25600 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD432G3200HC14BQC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 16GB(2x8GB) 4133MHz CL18 33000 MB/s 1.4V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD416G4133HC18EDC01 ADD
XTREEM x 8PACK DDR4 OVERCLOCKING DESKTOP MEMORY 16GB(2x8GB) 4000MHz CL18 32000 MB/s 1.35V Desktop computer with DDR4 Memory Slots Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP TXBD416G4000HC18GDC01 ADD
More Product Specifications
Dimensions
46.1(H) x 134(L) x 9(W)mm
Heat Spreader
Aluminum heat spreader
Operating Temperature
0°C ~ 85°C
Storage Temperature
-20°C ~ 65°C
Warranty
Lifetime warranty
Notes
1. Product Applicability and Compatibility
  • TEAMGROUP memory modules are designed for desktop or laptop computers that support DDR4 DRAM (depending on the product model). However, final compatibility is determined by the motherboard, processor (CPU), and BIOS support.
  • The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility. For example, even if you purchase a DDR4-3200 memory, if the motherboard or CPU only supports DDR4-2666, the memory will not exceed that frequency.
  • Before purchasing, please confirm whether your motherboard, processor (CPU), and BIOS support the memory specifications you intend to buy.
  • Some older Intel chipset may not support newer interface memory modules. Before purchasing, please refer to the motherboard and processor (CPU) specifications or consult the manufacturer for confirmation.
  • If XMP 2.0 (Intel) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR4-2133/2400 (or lower). This is a normal phenomenon and not a product defect.
  • It is recommended to update your motherboard BIOS before installing the memory to ensure optimal compatibility and performance.

2. Memory Frequency and XMP2.0 Settings
  • The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility.
  • If XMP 2.0 (Intel) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR4-2133/2400 (or lower). This is a normal phenomenon and not a product defect.
  • XMP 2.0 must be manually enabled by the user. Some motherboards may not reach the stated frequency, as the final operating frequency depends on system settings and hardware specifications.
  • Overclocking (such as enabling XMP 2.0 settings) is not part of the JEDEC standard and may affect system stability. If overclocking causes system instability, please revert to the BIOS default settings.
  • The stated frequency of the memory module is the maximum achievable frequency. However, not all systems will be able to reach it.
  • If the memory cannot achieve the advertised frequency due to motherboard, processor, or BIOS limitations, this should not be considered a product defect and does not qualify for warranty claims.
  • TEAMGROUP memory modules are tested under standard voltage conditions. If you experience issues due to processor or motherboard failure, please contact the respective processor or motherboard manufacturer for after-sales support.

3. Overclocking and Voltage Settings
  • Enabling XMP 2.0 is considered overclocking. The final operating frequency and stability depend on the motherboard, CPU, and BIOS settings. Not all systems can achieve the advertised speeds. This is a normal phenomenon and not a product defect.
  • Overclocking may cause system instability or crashes. If such issues occur, please revert to the BIOS default settings and manually adjust to the optimal configuration.
  • Some motherboards may require BIOS updates and optimizations to ensure stable operation.
  • If the memory's clock speed, voltage, or timings are set beyond the official specifications (JEDEC / XMP 2.0), it may result in system instability or damage. TEAMGROUP is not responsible for such issues, and warranty scope coverage may be affected.

4. Warranty and Support
  • The warranty covers only material and manufacturing defects under normal use. It does not cover damage caused by overclocking, incorrect BIOS settings, voltage adjustments, environmental factors (such as high temperature, high humidity, electrostatic discharge), or incompatible hardware configurations.
  • The advertised frequency of the memory module is not a guaranteed value. TEAMGROUP is not responsible if the memory cannot reach the advertised frequency due to system compatibility issues, and such cases do not qualify for warranty claims.
  • If you encounter any compatibility or installation issues, please contact TEAMGROUP technical support for professional advice.

5. Important Reminders
  • Before purchasing, please make sure that your motherboard, processor (CPU), and BIOS support the memory module you are buying to avoid incompatibility issues.
  • The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
  • Do not mix memory modules of different capacities, frequencies, brands, or models. Each memory kit is paired through compatibility testing. Mixing different kits may cause system instability or failure to boot.
  • If the system fails to boot, runs unstably, or does not achieve the advertised frequency, ensure that the BIOS is updated and that XMP 2.0 is manually enabled.
  • Different memory brands may have variations in internal timing, which could affect compatibility. To ensure system stability, it is not recommended to mix different brands or specifications of memory modules.
  • We reserve the right to modify product specifications without prior notice.
  • The recommended operating temperature range for this product is 0°C to 85°C, and the recommended storage temperature range is -20°C to 65°C.
  • The actual maximum temperature tolerance varies depending on the IC grade and module design of each specific part number. For long-term operation in extreme environments, please contact our technical support team for further evaluation and recommendations. Operation outside the recommended temperature ranges may affect product lifespan and data reliability and is not covered under standard warranty conditions.
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