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TEAMGROUP announces the Online Launch Event 2021 with three major themes: Heat Dissipation, Large Capacity, and DDR5, which will be held live on September 23 at 10 pm Taipei (UTC+8), 10 am New York (UTC-4) and 3 pm London (UTC+1) simultaneously. The event will once more showcase TEAMGROUP's product development capabilities and industry-leading technologies. In addition to focusing on the three major themes again, the launch will feature special effect scenes to highlight the design concepts of the new lineup.
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Leading global memory brand TEAMGROUP has been expanding in the industrial field for many years. Today, the company launched multiple industrial-grade innovative technology solutions, including the M.2 SATA SSD S750-M80, the mSATA SSD S750-3A, and the DDR4 WT DIMM product series.
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Today its sub-brands T-CREATE and T-FORCE launched two new SSDs for creators and gamers seeking the top upgrade: the blazingly fast T-CREATE CLASSIC Thunderbolt3 External SSD that supports Thunderbolt and USB interfaces, and the T-FORCE CARDEA Z44L PCIe4.0 SSD, which features a TEAMGROUP-patented and -designed ultra-thin graphene heat sink.
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Today TEAMGROUP is launching its brand new DELTA DDR5 Memory Series, the first DDR5 modules to be equipped with RGB lighting effect, providing gamers who enjoy visual flair with both next-level speed and eye-pleasing illumination.
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At the end of July, Sony Interactive Entertainment (SIE) announced the specifications and guidelines for expanding the console’s built-in internal storage and confirmed that the PlayStation 5 (PS5) [1] will now support M.2 SSDs for users to expand storage for game files and applications on the PS5. Today, TEAMGROUP's gaming brand, T-FORCE, is unveiling the T-FORCE CARDEA A440 Pro Special Series M.2 PCIe SSD with the industry's first-ever white graphene heat sink. The latest M.2 SSD, made specifically for expanding storage and will be available for gamers around the world on major e-commerce platforms in October, 2021.
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As a global memory leader with a long-term focus on industrial applications, TEAMGROUP has recognized the tremendous processing needs of the HPC market. To meet the demand for industrial memory can handle sustained high-speed data transmission with low latency, TEAMGROUP has utilized the in-house developed and patent-protected TRUST+ wide temperature technology to provide customers with high stability, durability and wide temperature industrial memory.
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Global memory leader TEAMGROUP today announces its distribution agreement with SYNNEX Corporation, a leading provider of distribution, systems design and integration services for the technology industry, to expand its reach through SYNNEX resellers in North America. TEAMGROUP’s SSDs, as well as memory solutions from TEAMGROUP’s T-FORCE brand, a line dedicated to gaming, will be available immediately to partners.
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Leading memory provider TEAMGROUP today announced that all of its industrial storage products have passed military standards testing for shock and vibration resistance. The company’s unique graphene-coated copper heatsink was also awarded a U.S. utility patent and is the world’s first heat sink to be used for industrial SSDs. In response to the growing Artificial Intelligence of Things (AIoT) and edge computing trends, TEAMGROUP continues to improve the durability, reliability, and safety of its industrial products, striving to create innovative solutions in the field of industrial control.
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As a leading provider of memory storage products and mobile applications to the consumer market, Team Group is committed to providing the best storage, multimedia and data sharing solutions. All Team memory module products come with a lifetime warranty, repair, and replacement services.
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