XTREEM DDR5 DESKTOP MEMORY BLACK
FEATURE & CAUTION
FEATURE
CAUTION
- Combo Quick One-Click Overclocking Certification
(Invention patent number in Taiwan: I914103) - Honorable T-FORCE Logo exceeds overclocking limits
- Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation
- Sturdy 2mm heat spreader for perfect heat dissipation improvement
- High-quality IC with the patented technique
- Power management chip for stable and effective power usage
- On-Die ECC for a more stable system
- Lifetime warranty
CAUTION
- For a complete list of compatible platforms, please refer to the "Compatibility Inquiry" section.
- Before purchasing memory products, please check the QVL (Qualified Vendor List) compatibility list provided by the motherboard manufacturer.
- Do not mix memory modules of different capacities, frequencies, brands, or models. Each memory kit is paired through compatibility testing. Mixing different kits may cause system instability or failure to boot.
- The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
- The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility.
- If XMP 3.0 (Intel) or EXPO (AMD) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR5-4800 (or lower). This is a normal phenomenon and not a product defect.
- XMP 3.0 / EXPO must be manually enabled by the user. Some motherboards may not reach the stated frequency, as the final operating frequency depends on system settings.
- Overclocking (such as enabling XMP 3.0 / EXPO settings) is not part of the JEDEC standard and may affect system stability. If overclocking causes system instability, please revert to the BIOS default settings.
- The stated frequency of the memory module is the maximum achievable frequency. However, not all systems will be able to reach it.
- Ensure that your motherboard and processor support the corresponding overclocking technologies (XMP 3.0 / EXPO); otherwise, the memory may not reach the advertised overclocking frequency.
- TEAMGROUP memory modules are tested under normal voltage conditions. If there are any issues related to processor or motherboard malfunctions, please contact the respective after-sales service of the processor or motherboard manufacturer.
Introduction
Combo Quick One-Click Overclocking Certification
Supports the latest Intel XMP3.0 and AMD EXPO overclocking technologies, and has passed complete compatibility and stability tests with ASRock, ASUS, BIOSTAR, GIGABYTE, and MSI motherboards. This ensures performance enhancement under optimal compatibility, allowing users to enjoy stable overclocking on both Intel and AMD platforms with one click.
Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.
Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.
Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.
High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
Lifetime warranty
Comprehensive lifetime warranty is offered where exchanges free-of-charge for non-man-made damage are available under a simple and streamlined service.
| Module Type | Capacity | Frequency | Latency | Data Transfer Bandwidth | Voltage | Compatibility | TEAM P/N | Compare |
|---|---|---|---|---|---|---|---|---|
| XTREEM DDR5 DESKTOP MEMORY | 96GB(2x48GB) | 6800MHz | CL36 | 54400 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD596G6800HC36DDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 64GB(2x32GB) | 6400MHz | CL34 | 51200 MB/s | 1.35V | Intel 800/700 series ; AMD 800/600 series | FFXD564G6400HC34BDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 64GB(2x32GB) | 6400MHz | CL32 | 51200 MB/s | 1.4V | Intel 800/700 series ; AMD 800/600 series | FFXD564G6400HC32ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 64GB(2x32GB) | 6000MHz | CL38 | 48000 MB/s | 1.35V | Intel 800/700 series ; AMD 800/600 series | FFXD564G6000HC38ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 64GB(2x32GB) | 6000MHz | CL30 | 48000 MB/s | 1.4V | Intel 800/700 series ; AMD 800/600 series | FFXD564G6000HC30CDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 48GB(2x24GB) | 8200MHz | CL38 | 65600 MB/s | 1.4V | Intel 800/700 series | FFXD548G8200HC38EDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 48GB(2x24GB) | 8000MHz | CL38 | 64000 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD548G8000HC38EDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 48GB(2x24GB) | 7600MHz | CL36 | 60800 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD548G7600HC36EDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 48GB(2x24GB) | 7200MHz | CL34 | 57600 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD548G7200HC34ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 48GB(2x24GB) | 6800MHz | CL34 | 54400 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD548G6800HC34ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 8000MHz | CL38 | 64000 MB/s | 1.45V | Intel 800/700 series ; AMD 800 series | FFXD532G8000HC38DDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 7600MHz | CL36 | 60800 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD532G7600HC36FDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 7200MHz | CL34 | 57600 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD532G7200HC34ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 6800MHz | CL34 | 54400 MB/s | 1.4V | Intel 800/700 series ; AMD 800 series | FFXD532G6800HC34BDC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 6400MHz | CL32 | 51200 MB/s | 1.35V | Intel 800/700 series ; AMD 800/600 series | FFXD532G6400HC32ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 6000MHz | CL38 | 48000 MB/s | 1.25V | Intel 800/700 series ; AMD 800/600 series | FFXD532G6000HC38ADC01 | ADD |
| XTREEM DDR5 DESKTOP MEMORY | 32GB(2x16GB) | 6000MHz | CL30 | 48000 MB/s | 1.35V | Intel 800/700 series ; AMD 800/600 series | FFXD532G6000HC30DC01 | ADD |
More Product Specifications
Dimensions
48.8(H) x 134.5(L) x 8.2(W) mm
Heat Sink
Aluminum heat-sink
Profile
- 8200 MHz↑: Intel XMP3.0
- 8000 MHz↓: Intel XMP3.0 / AMD EXPO
Operating Temperature
0°C ~ 85°C
Storage Temperature
-20°C ~ 65°C
Warranty
Lifetime Warranty
Notes
1. Product Applicability and Compatibility
- TEAMGROUP memory modules are designed for desktop or laptop computers that support DDR5 DRAM (depending on the product model). However, final compatibility is determined by the motherboard, processor (CPU), and BIOS support.
- The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility. For example, even if you purchase a DDR5-6000 memory, if the motherboard or CPU only supports DDR5-5600, the memory will not exceed that frequency.
- Before purchasing, please confirm whether your motherboard, processor (CPU), and BIOS support the memory specifications you intend to buy.
- Some older Intel/AMD chipset may not support newer interface memory modules. Before purchasing, please refer to the motherboard and processor (CPU) specifications or consult the manufacturer for confirmation.
- If XMP 3.0 (Intel) or EXPO (AMD) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR5-4800 (or lower). This is a normal phenomenon and not a product defect.
- It is recommended to update your motherboard BIOS before installing the memory to ensure optimal compatibility and performance.
2. Memory Frequency and XMP3.0-EXPO Settings
- The final operating frequency of the memory depends on system BIOS settings, and motherboard and CPU compatibility.
- If XMP 3.0 (Intel) or EXPO (AMD) is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR5-4800 (or lower). This is a normal phenomenon and not a product defect.
- XMP 3.0 / EXPO must be manually enabled by the user. Some motherboards may not reach the stated frequency, as the final operating frequency depends on system settings and hardware specifications.
- Overclocking (such as enabling XMP 3.0 / EXPO settings) is not part of the JEDEC standard and may affect system stability. If overclocking causes system instability, please revert to the BIOS default settings.
- The stated frequency of the memory module is the maximum achievable frequency. However, not all systems will be able to reach it.
- If the memory cannot achieve the advertised frequency due to motherboard, processor, or BIOS limitations, this should not be considered a product defect and does not qualify for warranty claims.
- TEAMGROUP memory modules are tested under standard voltage conditions. If you experience issues due to processor or motherboard failure, please contact the respective processor or motherboard manufacturer for after-sales support.
3. Overclocking and Voltage Settings
- Enabling XMP 3.0 / EXPO is considered overclocking. The final operating frequency and stability depend on the motherboard, CPU, and BIOS settings. Not all systems can achieve the advertised speeds. This is a normal phenomenon and not a product defect.
- Overclocking may cause system instability or crashes. If such issues occur, please revert to the BIOS default settings and manually adjust to the optimal configuration.
- Some motherboards may require BIOS updates and optimizations to ensure stable operation.
- If the memory's clock speed, voltage, or timings are set beyond the official specifications (JEDEC / XMP 3.0 / EXPO), it may result in system instability or damage. TEAMGROUP is not responsible for such issues, and warranty scope coverage may be affected.
4. Warranty and Support
- The warranty covers only material and manufacturing defects under normal use. It does not cover damage caused by overclocking, incorrect BIOS settings, voltage adjustments, environmental factors (such as high temperature, high humidity, electrostatic discharge), or incompatible hardware configurations.
- The advertised frequency of the memory module is not a guaranteed value. TEAMGROUP is not responsible if the memory cannot reach the advertised frequency due to system compatibility issues, and such cases do not qualify for warranty claims.
- If you encounter any compatibility or installation issues, please contact TEAMGROUP technical support for professional advice.
5. Important Reminders
- Before purchasing, please make sure that your motherboard, processor (CPU), and BIOS support the memory module you are buying to avoid incompatibility issues.
- Do not mix memory modules of different capacities, frequencies, brands, or models. Each memory kit is paired through compatibility testing. Mixing different kits may cause system instability or failure to boot.
- The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
- If the system fails to boot, runs unstably, or does not achieve the advertised frequency, ensure that the BIOS is updated and that XMP 3.0 / EXPO is manually enabled.
- Different memory brands may have variations in internal timing, which could affect compatibility. To ensure system stability, it is not recommended to mix different brands or specifications of memory modules.
- We reserve the right to modify product specifications without prior notice.
- The recommended operating temperature range for this product is 0°C to 85°C, and the recommended storage temperature range is -20°C to 65°C.
- The actual maximum temperature tolerance varies depending on the IC grade and module design of each specific part number. For long-term operation in extreme environments, please contact our technical support team for further evaluation and recommendations. Operation outside the recommended temperature ranges may affect product lifespan and data reliability and is not covered under standard warranty conditions.
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