512GB, 256GB, 128GB
Graphene- 8.3% cooling
N75A/N75G has passed our rigorous internal laboratory tests and burn-in test. The patented ultra-thin graphene heat sink features graphene material with excellent thermal conduction performance, delivering heat dissipation rates of up to 8.3%. The patented high-strength aluminum fin heat sink features a unique thermal diversion design, capable of effectively reducing the temperature by up to 23.8%.
Leading heat dissipation solution
In response to the development of 5G communication, the increasing demand for smart edge computing and high-speed operation during 24 hours non-stop. The rugged industrial SSD, N75A-M80 and N75G-M80, equipped with patented heat sinks. Can be used in a limited space environment and provide excellent cooling performance, overcoming the extreme environments.
Exclusive patented heat dissipation technology
SSD outstanding performance and high endurance are well supported by patented aluminum fin and graphene heat sinks.
Wide temperature - Industrial high specification and durable 3D TLC chip, overcome the extreme environments
2021 Computex d&i awards
2022 Taiwan Excellence Awards
Won the 2021 COMPUTEX d&i awards and 2022 Taiwan Excellence Awards, N75G-M80 is sole “industrial-grade”SSD product of the award-winning entries.
|Model||N75A-M80 / N75G-M80|
|Interface||PCIe 3.0 x4|
|Flash Type||3D TLC|
|Capacity||128GB / 256GB / 512GB|
|Sequential R/W||R/W: 3,500 / 2,100MB/s (Max.)|
|Dimension||N75G-M80 : 80.0(L) x 22.0(W) x 3.8(H) mm (with Graphene heat sink)
N75A-M80 : 80.0(L) x 23.4(W) x 12.9(H) mm (with Aluminum heat sink)
|MTBF||> 3 million hours|
|Storage Temperature||-55°C (-67°F) ~ 95°C (203°F)|
|Operation Temperature||-40°C (-40°F) ~ 85°C (185°F)|
|Humidity||5% ~ 95%|
|Energy Consumption (Operation)||4.27W(512GB Max)|
|Energy Consumption (Non-operation)||0.82W(512GB Max)|
|External DRAM Buffer||√|
|Warranty||3-year limited warranty|