Team Group Inc. Team Group Inc.


3600, 3200, 3000, 2666

  • Armor design for perfect protection
  • Aluminum alloy heat sink with high performance
  • High thermal conductive adhesive
  • Supports Intel & AMD motherboards
  • Selected high-quality IC
  • Supports XMP2.0
  • Energy saving with ultra-low working voltage
  • Taiwan Utility PATENT (number:M585419)
  • Chinese Utility PATENT (number: CN 210038691 U)
Armor design, Metal logo

Armor design, Metal logo

The design based on the concept of an armored knight and a sacred war robe offers more complete protection by refining the heat sink made by the traditional punch press process. Electrolytic anodizing process and metal electroforming logo design are used to echo with the tech armor.

Reinforced structure, Enhanced heat dissipation

It is made by punch press process with a 0.8mm thick, one-piece alloy aluminum. In addition, coloring with the electrolytic anodizing process can offer corrosion resistance and make it non-conductive. By transferring the heat from superconductive thermal adhesive to alloy cooing modules through heat conduction, the overclocking memory can be maintained within operating temperature.

Reinforced structure, Enhanced heat dissipation
Selected IC chips, Stable and durable

Selected IC chips, Stable and durable

Every IC chip made for TEAMGROUP’s T-FORCE DARK Z DDR4 gaming memory is selected through a rigorous testing process. Every overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.

High performance, Low power consumption, Easy upgrade

In addition to the increase in data transfer rate, the basic working voltage of the new generation of upgraded DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.

High performance, Low power consumption, Easy upgrade
Supports Intel XMP, Auto overclocking

Supports Intel XMP, Auto overclocking

T-FORCE DARK Z DDR4 gaming memory is plug and play ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible to both Intel & AMD platform, therefore gamers can build their system without worries.


T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.


Product Specifications

Module Type

288 Pin Unbuffered DIMM Non ECC


8GB / 16GB/ 32GB / 8GBx2 / 16GBx2 / 32GBx2

Frequency 2666 3000 3200 3600
Data Transfer Bandwidth

21,328 MB/s

(PC4 21300)

24,000 MB/s

(PC4 24000)

25,600 MB/s

(PC4 25600)

28,800 MB/s

(PC4 28800)
Latency CL15-17-17-35
CL16-18-18-38 CL16-18-18-38 CL18-22-22-42
Voltage 1.2V 1.35V
Dimensions 43.5(H) x 141(L) x 8.3(W)mm
Heat Spreader Aluminum heat spreader
Warranty Lifetime warranty
  • We reserve the right to modify product specifications without prior notice.