Team Group Inc. Team Group Inc.

D500-W MSD

512GB, 256GB, 128GB, 64GB, 32GB

Features
  • Compliant SD Card Specification 3.0
  • 3D TLC NAND Flash
  • Power fail management
  • Advanced wear leveling
  • Bad block mangement
  • Support Auto-Reflash
  • Support S.M.A.R.T. health monitoring
Color
IntroductionSpecification
TEAMGROUP Industrial-grade SD Cards

TEAMGROUP Industrial-grade SD Cards

Team Group industrial-grade memory cards built with top-quality 3D TLC NAND Flash chips,  can endure operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even in the harshest conditions. These cards are the ideal solution for small form factor applications.

Product Specifications

Model D500 MSD
Interface SD 3.0
Flash Type 3D TLC
Capacity 32GB / 64GB / 128GB / 256GB / 512GB
Sequential R/W R/W: 85 / 35MB/s
Max. Power consumption 3.3V x 400uA
Dimension 15.0(L) x 11.0(W) x 1.0(H) mm
Shock
  • Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A)
  • Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration
  • NOperation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General)
  • Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
MTBF > 3 million hours
Storage Temperature -50°C (-58°F) ~ +95°C (203°F)
Operation Temperature -40°C (-40°F) ~ +85°C (185°F)
P/E Cycle 3K
Ingress Protection IP68
S.M.A.R.T.
Warranty 3-year limited warranty
NOTES:
  • We reserve the right to modify product specifications without prior notice.

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