Support the Latest HEDT Platform
from Intel & AMD

Adoption of 3D QLC Flash-memory Chips,
Large Capacity in Ultra-thin PCIe

Compatible with Switch™ and Gaming Devices,
Action Cameras and Mobile Devices

Effective Cooling Technology,
Flexible Heatsink Installation

Aerospace Ceramic Technology,
Ultra-thin and Lightweight Heatsink

  • DDR5-4800 16GB
  • Doubled banks compared to DDR4
  • 1.1V Ultra-low Working Voltage
  • Support On-die ECC

Follow the steps below to gain the access to the giveaway. Good luck!

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