Home Product T-Force Gaming Series Gaming Memory Modules DDR4 MEMORY MODULES XTREEM DDR4

XTREEM DDR4

3466, 3600, 3733, 3866, 4000

Features
● The finest crafted heat spreader with unique trench design
● High-efficiency aluminum heat spreader
● 10 layers of circuit board
● Selected high quality SAMSUNG original IC chips
● 1.2V~1.4V ultra low working voltage
● Support Intel XMP 2.0 smart overclocking technology
● QVL approved by motherboard manufactures in the market
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View specification

The Unprecedented Moment of Glory

In the date of January 13th, 2017, when Thai Overclocker, “Audigy”, submitted the historic DDR4 5260.8mhz to the CPUZ as DRAM world record frequency, the whole overclocking world was shocked by how amazing TForce Xtreem is. Yet after the storm, the Xtreem never took the rest, Audigy sealed another world record, 5280Mhz, in the date of March 30th, 2017.

Until this moment as May of 2017, the world’s top 3 records are all in the name of Team Group T-Force Xtreem. Consequently, this DRAM overclocking legend is born, “The Special Edition of T-Force Xtreem!.” It is made by high selected and hand screened IC from Samsung Original 21st Nano –Micron DDR4 B-die IC topped Jedec newest RC 2.0 pcb, and high quality aluminum CNC craft heat spreader with overclocking mentor, Onepagebook, use high power laser technology autograph on the pure black coating TForce name plate. The quantity of this Xtreem Special Edition is highly restricted for only 50 sets. It is only for the people who would like to ride to the journey of their own world record.

Teamgroup T-Force DDR4 Gaming Xtreem

QVL approved by motherboard manufacturers

Multiple compatibility verifications with mainstream DDR4 motherboards to make sure its stability with all motherboards on the QVL(Qualified Vendor List). Therefore, you wouldn’t’ have to worry about compatibility issues when purchasing high speed memory.

                          

                          

 

With unique trench design and improve radiating performance 10%

The Team Group design team had built a heat spreader with an all new exterior design concept. The overclocking memory module with highest specification is built by top notch aluminum extrusion process and CNC machining. The unique trench design can increase the radiating area to improve radiating efficiency. XTREEM combines simple and magnificent design with its top specification overclocking memory module. The clean, sleek lines are able to magnify its high speed specification.

Teamgroup T-Force DDR4 Gaming Xtreem
Teamgroup T-Force DDR4 Gaming Xtreem

10layers of circuit board largely improves stabilit

The number of PCB layers is 25% more than normal memories. This provides better efficiency and performance since the power layer and the signal layer has a farther distance between each other. Without the interference between the power and the signal, it can offer players the overclocking pleasure and a high stability overclocking memory module.

Selected high quality SAMSUNG original IC chips

Team Group insists on using high quality SAMSUNG original IC chips and passed through various rigorous internal tests. Its high reliability makes players feel at ease.

Teamgroup T-Force DDR4 Gaming Xtreem
Teamgroup T-Force DDR4 Gaming Xtreem

Ultra low working voltage Save energy up to 40%

With low working voltage 1.2~1.4V from DDR4 XTREEM , it is not only energy saving but it can also reduce the temperature and the heat generated to offer the high speed running memory a stable and long time operation.

XMP2.0 1step overclocking technology

All XTREEM series support Intel XMP 2.0. It is only one click away to experience the high speed sensation of overclocking.

Teamgroup T-Force DDR4 Gaming Xtreem

Xtreem won the COMPUTEX d&i Awards 2017

T-Force is Team Force , TF. The RED T represents Team Group with its decades of accumulated passion and position in storage products, as well as the Black F is the Force of Team Group's combined knowledge and over 18 years of research and development in Storage Segment.

T-Force, TF, spread the Wings and Fly is the Logos schematization of TF. The simple message of the spreading spirit of TF wings, fly high and fast with the force in Team Group gaming products, fly strong with TF's spirit.

Video

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Product Specifications

ITEM SPECIFICATION
Module Type

288 Pin Unbuffered DIMM Non ECC

Capacity

4GBx2 / 8GBx2

8GBx2
Frequency 3466 3600 3733 3866 4000 4133*
Data transfer bandwidth

27,728 MB/s

(PC4 27700)

28,800 MB/s

(PC4 28800)

29,864 MB/s

(PC4 29800)

30,928 MB/s

(PC4 30900)

32,000 MB/s

(PC4 32000)

33,000 MB/s

(PC4 33000)
CL-Value CL17-19-19-39 CL17-19-19-39
CL18-20-20-39
CL17-19-19-39
CL18-20-20-39
CL18-20-20-39
CL18-20-20-44
CL18-20-20-44 CL18-18-18-38
Voltage 1.35V 1.4V
Heat Sink Aluminum heat-sink
Operation System

Desktop or notebook computer with DDR4 Memory Slots
Required OS: Windows 10 / 8.1 / 8 / 7 / Vista / XP

Warranty Lifetime Warranty
System requirements (Skylake)
  • Desktop computer with DDR4 Memory Slots
  • Required OS: Windows XP/Vista/7/8/8.1/10
Notes:
  • We reserve the right to modify product specifications without prior notice.